Custom PCB Manufacturing
— Multilayer, HDI, Rigid-Flex & High-Reliability Boards
Berna Electronics delivers world-class PCB fabrication — from standard multilayer boards to the most demanding high-reliability designs. We produce bare PCBs up to 60 layers, with advanced capabilities in HDI (up to 7+N+7, Any Layer), rigid-flex, controlled impedance (±5%), and specialty materials including Panasonic Megtron, Rogers, ITEQ, and Taconic laminates.
All boards are manufactured to IPC Class 2 and IPC Class 3 standards, with certified quality systems including IATF 16949 (automotive), ISO 13485 (medical), ISO 14001, and QC080000 — supporting applications in automotive, medical, aerospace, industrial electronics, and semiconductor equipment.
Capability
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Layer Count: up to 60 layers (rigid multilayer); up to 16 layers (rigid-flex)
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HDI: 1+N+1 to 7+N+7, Any Layer — laser-drilled microvias (min. 0.060mm), sequential lamination, mSAP process
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Heavy Copper: ½ oz to 12 oz (inner and outer layers)
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High-Speed & High-Frequency PCBs — Panasonic Megtron series, Rogers RO4003/RO4350B/RO3003, ITEQ, TUC, EMC, Taconic laminates
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HDI: 3 Plus
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Rigid-Flex PCBs + HDI — up to 16 layers total, polyimide flex, laser blind & through vias, ZIF goldfingers, IPC-6013
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Controlled Impedance: ±5% tolerance — single-ended and differential pair
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Blind & Buried Vias, Via-in-Pad (VIP / POFV), Back-drilling
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Embedded Copper Coin — for thermal management in high-power applications
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Embedded Passive Components (resistors/capacitors)
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Cavity PCBs, Depth-Control Drilling, Hybrid Stack-up / Step Lamination
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High Tg FR4 (Tg 150–180°C), Ceramic PCBs, Metal Core / Metal Base PCBs
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IC Substrate / Substrate-Like PCBs (SLP) — 2 to 6 layers
PCB
Type
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RF & Microwave PCBs / Antenna PCBs
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Multi-line Card
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Multilayer PCBs (standard FR4 and high-performance laminates)
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High-Frequency PCBs (Rogers, Megtron, Taconic, ITEQ)
Heavy Copper PCBs (up to 12 oz)
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Rigid-Flex PCBs
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Metal Core / Metal Base PCBs
Substrate PCBs
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Substrate-Like PCBs (SLP) / IC Substrate (2–6 layers)
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Backplane PCBs
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Power Electronics PCBs (embedded copper coin, thermal management)
Surface
Finishing
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ENIG (Electroless Nickel Immersion Gold
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HASL / Lead-Free HASL (LF-HASL)
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OSP (Organic Solderability Preservative)
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Hard Gold Plating / ENEPIG
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Immersion Tin (Im-Sn) / Immersion Silver (Im-Ag)
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Goldfinger (hard gold edge connectors)
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Selective Surface Finishing
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OSP + ENIG (combination finish)
WHY SOURCE YOUR PCBS THROUGH BERNA ELECTRONICS?
At Berna Electronics, we combine world-class manufacturing capability with local technical support, manufacturability review (DFM), and full supply chain accountability. Whether you need a 4-layer FR4 prototype or a 60-layer controlled impedance backplane for automotive or aerospace, we qualify the right solution for your specific design requirements — with full traceability, certifications, and on-time delivery.